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[English Market Research Report] The Global Market for 3D IC Packaging

[English Market Research Report] The Global Market for 3D IC Packaging

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3D IC packaging is one of the packaging technologies. It is used in various end-user industries such as consumer electronics, aerospace and defense, medical devices, telecommunications, and automotive. In this method, active chips are integrated through die stacking to achieve the shortest interconnections and the smallest package footprint. It is also possible to mount multiple ICs within the same package. The 3D IC packaging market is expanding due to factors such as the increasing demand for electronic products and the miniaturization of electronic devices.

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[Report] The Global Market for 3D IC and 2.5D IC Packaging

[Report] The Global Market for 3D IC and 2.5D IC Packaging

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The market size for 3D IC and 2.5D IC packaging worldwide is expected to grow from 49.3 billion USD in 2023 to 82 billion USD by 2028, with a CAGR of 10.7% from 2023 to 2028. Key factors driving the growth of the 3D IC and 2.5D IC packaging market include the increasing trend of higher integration density and miniaturization of electronic devices, as well as the growing demand for consumer electronics and gaming devices.

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[Research Report] 3D IC and 2.5D IC Packaging Market

[Research Report] 3D IC and 2.5D IC Packaging Market

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The global 3D IC and 2.5D IC packaging market is projected to reach approximately $81.1 billion by 2028, with a CAGR of 11% from 2023 to 2028. The main drivers of this market are the increasing demand for miniaturized IoT-based devices, the emergence of 5G technology, and the proliferation of high-end computing, servers, and data centers. The future of the global 3D IC and 2.5D IC packaging market is seen as promising, with business opportunities in consumer electronics, industrial, telecommunications, automotive, military and aerospace, and medical device industries.

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